• 焊接貼裝
• SMT (BGA, uBGA, PoP and 01005, 008004)
• BGA/CSP/CBGA/CCGA/PGA Down To 0.27mm
• Soldering & Flip Chip with Die Size of 0.5~50mm
• COB/FOG/PoP
• Multi-Chip, Chip On FPC
• 焊接貼裝
• SMT (BGA, uBGA, PoP and 01005, 008004)
• BGA/CSP/CBGA/CCGA/PGA Down To 0.27mm
• Soldering & Flip Chip with Die Size of 0.5~50mm
• COB/FOG/PoP
• Multi-Chip, Chip On FPC
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